Abstract

Thin and thick film materials are widely used in modern electronic circuits due to their ability to provide miniaturization, high performance, and cost-effective production. Thin film technology involves depositing layers of conductive, resistive, and dielectric materials onto a substrate, typically using methods like vacuum deposition or sputtering. Thick film technology, on the other hand, uses a screen-printing process to deposit paste-like materials onto substrates and is known for its durability and adaptability to harsh environments. Both technologies play crucial roles in designing analog and digital circuits, especially in fields like telecommunications, automotive electronics, and medical devices. The increasing demand for smaller, faster, and more efficient electronic devices has put pressure on the development of high-performance circuits using thin and thick film technologies. A key challenge is optimizing material properties to balance electrical performance, thermal management, and mechanical reliability in both analog and digital circuits. This study explores the design and performance evaluation of analog and digital circuits using thin and thick film materials. Thin film circuits were fabricated using sputtering techniques to deposit layers of resistive and conductive materials with precise thickness control. Thick film circuits were created by screen-printing conductive, resistive, and dielectric pastes onto ceramic substrates. Electrical performance was tested for both types of circuits, focusing on parameters such as resistance, capacitance, and inductance. The thin film circuits demonstrated superior electrical performance with lower parasitic inductance and capacitance, achieving a resistance tolerance of ±1% and a thermal coefficient of resistance (TCR) of ±50 ppm/°C. The thick film circuits, while having slightly higher parasitic values, offered robustness and mechanical stability in high-temperature environments, with TCR values ranging from ±100 to ±250 ppm/°C. Both technologies showed significant promise, with the choice of material depending on the specific application requirements for analog and digital systems.