Abstract

Flip-flops are the basic building blocks of any sequential circuits which occupy the maximum area in a circuit. So the robustness of the system greatly depends on the reliable operation of the flip-flop. In this work the PowerPC 603 flip-flop is simulated and analyzed to measure its reliability against variations in supply voltage and temperature. Performance analysis has been made by having Power, Delay and PDP as Figures of Merit. The acquired simulation results revealed the different sources of power consumption in different scenarios. The simulated results using finer technologies with Synopsys HSPICE prove that PowerPC 603 is a resilient flip-flop for all corners