Thin and thick film materials are widely used in modern electronic
circuits due to their ability to provide miniaturization, high
performance, and cost-effective production. Thin film technology
involves depositing layers of conductive, resistive, and dielectric
materials onto a substrate, typically using methods like vacuum
deposition or sputtering. Thick film technology, on the other hand, uses
a screen-printing process to deposit paste-like materials onto substrates
and is known for its durability and adaptability to harsh environments.
Both technologies play crucial roles in designing analog and digital
circuits, especially in fields like telecommunications, automotive
electronics, and medical devices. The increasing demand for smaller,
faster, and more efficient electronic devices has put pressure on the
development of high-performance circuits using thin and thick film
technologies. A key challenge is optimizing material properties to
balance electrical performance, thermal management, and mechanical
reliability in both analog and digital circuits. This study explores the
design and performance evaluation of analog and digital circuits using
thin and thick film materials. Thin film circuits were fabricated using
sputtering techniques to deposit layers of resistive and conductive
materials with precise thickness control. Thick film circuits were
created by screen-printing conductive, resistive, and dielectric pastes
onto ceramic substrates. Electrical performance was tested for both
types of circuits, focusing on parameters such as resistance,
capacitance, and inductance. The thin film circuits demonstrated
superior electrical performance with lower parasitic inductance and
capacitance, achieving a resistance tolerance of ±1% and a thermal
coefficient of resistance (TCR) of ±50 ppm/°C. The thick film circuits,
while having slightly higher parasitic values, offered robustness and
mechanical stability in high-temperature environments, with TCR
values ranging from ±100 to ±250 ppm/°C. Both technologies showed
significant promise, with the choice of material depending on the
specific application requirements for analog and digital systems.
C. Saravanakumar, N. Usha Bhanu
SRM Valliammai Engineering College, India
Thin film, Thick film, Analog circuits, Digital circuits, Circuit fabrication
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| Published By :
ICTACT
Published In :
ICTACT Journal on Microelectronics
( Volume: 10 , Issue: 3 , Pages: 1871 - 1878 )
Date of Publication :
October 2024
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